View GS864018GT-250I_619657.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Product Preview GS864018/32/36T-300/250/200/167
100-Pin TQFP Commercial Temp Industrial Temp Features
* FT pin for user-configurable flow through or pipeline operation * Single Cycle Deselect (SCD) operation * 2.5 V or 3.3 V +10%/-10% core power supply * 2.5 V or 3.3 V I/O supply * LBO pin for Linear or Interleaved Burst mode * Internal input resistors on mode pins allow floating mode pins * Default to Interleaved Pipeline mode * Byte Write (BW) and/or Global Write (GW) operation * Internal self-timed write cycle * Automatic power-down for portable applications * JEDEC-standard 100-lead TQFP package * Pb-Free 100-lead TQFP package available
4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs
300 MHz-167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O
cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or interleave order with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode pin low places the RAM in Flow Through mode, causing output data to bypass the Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the risingedge-triggered Data Output Register. Byte Write and Global Write Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Write control inputs. Sleep Mode Low power (Sleep mode) is attained through the assertion (High) of the ZZ signal, or by stopping the clock (CK). Memory data is retained during Sleep mode. Core and Interface Voltages The GS864018/32/36T operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V compatible. Separate output power (VDDQ) pins are used to decouple output noise from the internal circuits and are 3.3 V and 2.5 V compatible.
Functional Description
Applications The GS864018/32/36T is a 75,497,472-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support. Controls Addresses, data I/Os, chip enables (E1, E2, E3), address burst control inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positive-edge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst
Parameter Synopsis
tKQ tCycle Curr (x18) Curr (x32/x36) tKQ tCycle Curr (x18) Curr (x32/x36) -300 2.3 3.3 400 480 5.5 5.5 285 330 -250 2.5 4.0 340 410 6.5 6.5 245 280 -200 3.0 5.0 290 350 7.5 7.5 220 250 -167 3.5 6.0 260 305 8.0 8.0 210 240 Unit ns ns mA mA ns ns mA mA
Pipeline 3-1-1-1 Flow Through 2-1-1-1
Rev: 1.00 9/2004
1/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
GS864018 100-Pin TQFP Pinout (Package T)
VDDQ VSS NC NC DQB DQB VSS VDDQ DQB DQB FT VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC
NC NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 4M x 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 NC NC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC
Rev: 1.00 9/2004
LBO A A A A A1 A0 A A VSS VDD A A A A A A A A A 2/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
GS864032 100-Pin TQFP Pinout (Package T)
NC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC FT VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 2M x 32 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
NC DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA NC
Rev: 1.00 9/2004
LBO A A A A A1 A0 A A VSS VDD A A A A A A A A A 3/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
GS864036 100-Pin TQFP Pinout (Package T)
DQPC DQC DQC VDDQ VSS DQC DQC DQC DQC3 VSS VDDQ DQC DQC FT VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD DQPD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 2M x 36 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA
Rev: 1.00 9/2004
LBO A A A A A1 A0 A A VSS VDD A A A A A A A A A 4/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
TQFP Pin Description Symbol
A0, A1 A DQA DQB DQC DQD NC BW BA, BB BC, BD CK GW E1, E3 E2 G ADV ADSP, ADSC ZZ FT LBO VDD VSS VDDQ I I I I I I I I I I I I I I I I
Type
I I I/O
Description
Address field LSBs and Address Counter preset Inputs Address Inputs Data Input and Output pins No Connect Byte Write--Writes all enabled bytes; active low Byte Write Enable for DQA, DQB Data I/Os; active low Byte Write Enable for DQC, DQD Data I/Os; active low Clock Input Signal; active high Global Write Enable--Writes all bytes; active low Chip Enable; active low Chip Enable; active high Output Enable; active low Burst address counter advance enable; active low Address Strobe (Processor, Cache Controller); active low Sleep Mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply
Rev: 1.00 9/2004
5/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
GS864018/32/36 Block Diagram
Register
A0-An
D
Q A0 D0 A1 Q0 D1 Q1 Counter Load A0 A1
A
LBO ADV CK ADSC ADSP GW BW BA
Register
Memory Array
Q D Q D
Register
D BB
Q
36 4
36
Register
D BC
Q Q
Register
D
Register
Q
Register
D
D BD
Q
Register
D
Q
E1 E2 E3
Register
D
Q
Register
D
Q
FT G Power Down Control DQx1-DQx9
ZZ
Note: Only x36 version shown for simplicity.
Rev: 1.00 9/2004
6/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Mode Pin Functions Mode Name
Burst Order Control Output Register Control Power Down Control Single/Dual Cycle Deselect Control FLXDrive Output Impedance Control 9th Bit Enable
Pin Name
LBO FT ZZ SCD ZQ PE
State
L H L H or NC L or NC H L H or NC L H or NC L or NC H
Function
Linear Burst Interleaved Burst Flow Through Pipeline Active Standby, IDD = ISB Dual Cycle Deselect Single Cycle Deselect High Drive (Low Impedance) Low Drive (High Impedance) Activate DQPx I/Os (x18/x3672 mode) Deactivate DQPx I/Os (x16/x3272 mode)
Note: There is a are pull-up devices on the ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so thosethis input pins can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences
Linear Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10
Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.00 9/2004
7/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Byte Write Truth Table Function
Read Read Write byte a Write byte b Write byte c Write byte d Write all bytes
GW
H H H H H H H
BW
H L L L L L L
BA
X H L H H H L
BB
X H H L H H L
BC
X H H H L H L
BD
X H H H H L L
Notes
1 1 2, 3 2, 3 2, 3, 4 2, 3, 4 2, 3, 4
Write all bytes L X X X X X Notes: 1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs. 2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes. 3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs. 4. Bytes "C" and "D" are only available on the x32 and x36 versions.
Rev: 1.00 9/2004
8/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Synchronous Truth Table Operation
Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst
Address Used
None None None External External External Next Next Next Next Current Current Current
State Diagram Key5
X X X R R W CR CR CW CW
E1
H L L L L L X H X H X H X
E2
X F F T T T X X X X X X X
ADSP ADSC
X L H L H H H X H X H X H L X L X L L H H H H H H H
ADV
X X X X X X L L L L H H H
W3
X X X X F T F F T T F F T
DQ4
High-Z High-Z High-Z Q Q D Q Q D D Q Q D
Write Cycle, Suspend Burst Current H X X H H T D Notes: 1. X = Don't Care, H = High, L = Low 2. E = T (True) if E2 = 1 and E3 = 0; E = F (False) if E2 = 0 or E3 = 1 3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding. 4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown as "Q" in the Truth Table above). 5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish basic synchronous or synchronous burst operations and may be avoided for simplicity. 6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above. 7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.00 9/2004
9/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Simplified State Diagram
X
Deselect W W Simple Synchronous Operation R R
X CW
First Write
R CR
First Read
X CR
Simple Burst Synchronous Operation
W R X Burst Write CR CW
R
Burst Read
X
CR
Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and that ADSP is tied high and ADSC is tied low. 3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and assumes ADSP is tied high and ADV is tied low.
Rev: 1.00 9/2004
10/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Simplified State Diagram with G
X
Deselect W W X W CW R R
First Write
R CR
First Read
X CR
CW
W X Burst Write R CR W CW
R X
Burst Read
CW
CR
Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G. 2. Use of "Dummy Reads" (Read Cycles with G High) may be used to make the transition from Read cycles to Write cycles without passing through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles. 3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM's drivers off and for incoming data to meet Data Input Set Up Time.
Rev: 1.00 9/2004
11/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
VDD VDDQ VI/O VIN IIN IOUT PD TSTG TBIAS
Note:
Description
Voltage on VDD Pins Voltage in VDDQ Pins Voltage on I/O Pins Voltage on Other Input Pins Input Current on Any Pin Output Current on Any I/O Pin Package Power Dissipation Storage Temperature Temperature Under Bias
Value
-0.5 to 4.6 -0.5 to 4.6 -0.5 to VDDQ +0.5 ( 4.6 V max.) -0.5 to VDD +0.5 ( 4.6 V max.) +/-20 +/-20 1.5 -55 to 125 -55 to 125
Unit
V V V V mA mA W
o o
C C
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.
Power Supply Voltage Ranges Parameter
3.3 V Supply Voltage 2.5 V Supply Voltage 3.3 V VDDQ I/O Supply Voltage 2.5 V VDDQ I/O Supply Voltage
Symbol
VDD3 VDD2 VDDQ3 VDDQ2
Min.
3.0 2.3 3.0 2.3
Typ.
3.3 2.5 3.3 2.5
Max.
3.6 2.7 3.6 2.7
Unit
V V V V
Notes
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.00 9/2004
12/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
VDDQ3 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
2.0 -0.3 2.0 -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.8 VDDQ + 0.3 0.8
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
VDDQ2 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
0.6*VDD -0.3 0.6*VDD -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.3*VDD VDDQ + 0.3 0.3*VDD
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Recommended Operating Temperatures Parameter
Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions)
Symbol
TA TA
Min.
0 -40
Typ.
25 25
Max.
70 85
Unit
C C
Notes
2 2
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.00 9/2004
13/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Undershoot Measurement and Timing
VIH VDD + 2.0 V VSS 50% VSS - 2.0 V 20% tKC VIL 50% VDD
Overshoot Measurement and Timing
20% tKC
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Input Capacitance Input/Output Capacitance Note: These parameters are sample tested.
Symbol
CIN CI/O
Test conditions
VIN = 0 V VOUT = 0 V
Typ.
4 6
Max.
5 7
Unit
pF pF
AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level Output load
Conditions
VDD - 0.2 V 0.2 V 1 V/ns VDDQ/2 VDDQ/2 Fig. 1
Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table. Output Load 1 DQ 50 VDDQ/2
* Distributed Test Jig Capacitance
30pF*
Rev: 1.00 9/2004
14/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
DC Electrical Characteristics Parameter
Input Leakage Current (except mode pins) ZZInput Current FTInput Current Output Leakage Current (x36/x72) Output Leakage Current (x18) Output High Voltage Output High Voltage Output Low Voltage
Symbol
IIL IIN1 IIN2 IOL IOL VOH2 VOH3 VOL
Test Conditions
VIN = 0 to VDD VDD VIN VIH 0 V VIN VIH VDD VIN VIL 0 V VIN VIL Output Disable, VOUT = 0 to VDD Output Disable, VOUT = 0 to VDD IOH = -8 mA, VDDQ = 2.375 V IOH = -8 mA, VDDQ = 3.135 V IOL = 8 mA
Min
-2 uA -1 uA -1 uA -100 uA -1 uA -1 uA -1 uA 1.7 V 2.4 V --
Max
2 uA 1 uA 100 uA 1 uA 1 uA 1 uA 1 uA -- -- 0.4 V
Rev: 1.00 9/2004
15/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Operating Currents
-300 Parameter Test Conditions Mode Symbol IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ ISB ISB IDD IDD 0 to 70C 420 60 300 30 370 30 270 15 100 100 150 135 -40 to 85C 440 60 320 30 390 30 290 15 120 120 165 150 -250 0 to 70C 360 50 255 25 315 25 230 15 100 100 140 125 -40 to 85C 380 50 275 25 335 25 250 15 120 120 155 140 -200 0 to 70C 310 40 230 20 270 20 205 15 100 100 130 120 -40 to 85C 330 40 250 20 290 20 225 15 120 120 146 135 -167 0 to 70C 270 35 220 20 240 20 195 15 100 100 125 120 -40 to 85C 290 35 240 20 260 20 215 15 120 120 140 135 Unit
Operating Current
Device Selected; All other inputs VIH or VIL Output open
(x32/ x36)
Pipeline Flow Through Pipeline
mA mA mA mA mA mA mA mA
(x18)
Flow Through Pipeline Flow Through Pipeline Flow Through
Standby Current Deselect Current
ZZ VDD - 0.2 V Device Deselected; All other inputs VIH or VIL
--
--
Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario.
Rev: 1.00 9/2004
16/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
AC Electrical Characteristics
Parameter Clock Cycle Time Clock to Output Valid Pipeline Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock Cycle Time Clock to Output Valid Flow Through Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High-Z G to Output Valid G to output in Low-Z G to output in High-Z ZZ setup time ZZ hold time ZZ recovery Symbol tKC tKQ tKQX tLZ tS tH tKC tKQ tKQX tLZ1 tS tH tKH tKL tHZ1 tOE tOLZ1 tOHZ1 tZZS2 tZZH2 tZZR
1
-300 Min 3.3 -- 1.5 1.5 1.1 0.1 5.5 -- 3.0 3.0 1.5 0.5 1.0 1.2 1.5 -- 0 -- 5 1 20 Max -- 2.3 -- -- -- -- -- 5.5 -- -- -- -- -- -- 2.3 2.3 -- 2.3 -- -- -- 4.0 -- 1.5 1.5 1.2 0.2 6.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20
-250 Min Max -- 2.5 -- -- -- -- -- 6.5 -- -- -- -- -- -- 2.5 2.5 -- 2.5 -- -- -- 5.0 -- 1.5 1.5 1.4 0.4 7.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20
-200 Min Max -- 3.0 -- -- -- -- -- 7.5 -- -- -- -- -- -- 3.0 3.0 -- 3.0 -- -- -- 6.0 -- 1.5 1.5 1.5 0.5 8.0 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20
-167 Min Max -- 3.5 -- -- -- -- -- 8.0 -- -- -- -- -- -- 3.0 3.5 -- 3.0 -- -- --
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Notes: 1. These parameters are sampled and are not 100% tested. 2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above.
Rev: 1.00 9/2004
17/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Pipeline Mode Timing (SCD)
Begin
Read A
Cont
Cont
Deselect Write B Single Write tKL tKH tKC
Read C
Read C+1 Read C+2 Read C+3 Cont Burst Read
Deselect
Single Read
CK ADSP tS tH ADSC tS ADV tS tH A0-An
A B C ADSC initiated read
tH
tS GW tS BW tH tS Ba-Bd tS tH E1 tS tH E2 tS tH E3 G tS tOE DQa-DQd tOHZ
Q(A) D(B) E2 and E3 only sampled with ADSP and ADSC E1 masks ADSP Deselected with E1
tH
tKQ tH tLZ
Q(C) Q(C+1) Q(C+2)
tKQX tHZ
Q(C+3)
Rev: 1.00 9/2004
18/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Flow Through Mode Timing (SCD)
Begin
Read A
Cont tKL tKH
Cont tKC
Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Cont
Deselect
CK ADSP tS tH ADSC tS tH ADV tS tH A0-An
A B C Fixed High
tS tH ADSC initiated read
tS tH GW tS tH BW tS tH Ba-Bd tS tH E1 tS tH E2 tS tH E3 G tH tS tOE DQa-DQd
Q(A) Deselected with E1
E2 and E3 only sampled with ADSC
tOHZ
D(B)
tKQ tLZ
Q(C) Q(C+1) Q(C+2) Q(C+3) Q(C)
tHZ tKQX
Rev: 1.00 9/2004
19/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after 2 cycles of wake up time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH tKC CK Setup Hold ADSP ADSC tZZR tZZS ZZ tZZH tKL
Rev: 1.00 9/2004
20/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
TQFP Package Drawing (Package T) L Symbol
A1 A2 b c D D1 E E1 e L L1 Y
c Pin 1
Description
Standoff Body Thickness Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Length Coplanarity Lead Angle
Min. Nom. Max
0.05 1.35 0.20 0.09 21.9 19.9 15.9 13.9 -- 0.45 -- 0.10 1.40 0.30 -- 22.0 20.0 16.0 14.0 0.65 0.60 1.00 0.15 1.45 0.40 0.20 22.1 20.1 16.1 14.1 -- 0.75 -- 0.10
L1
e b
D D1
A1
Y
A2
E1 E
0
--
7
Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion.
Rev: 1.00 9/2004
21/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Ordering Information for GSI Synchronous Burst RAMs Org
4M x 18 4M x 18 4M x 18 4M x 18 2M x 32 2M x 32 2M x 32 2M x 32 2M x 36 2M x 36 2M x 36 2M x 36 4M x 18 4M x 18 4M x 18 4M x 18 2M x 32 2M x 32 2M x 32 2M x 32 2M x 36 2M x 36 2M x 36 2M x 36 4M x 18 4M x 18 4M x 18 2M x 32
Part Number1
GS864018T-300 GS864018T-250 GS864018T-200 GS864018T-167 GS864032T-300 GS864032T-250 GS864032T-200 GS864032T-167 GS864036T-300 GS864036T-250 GS864036T-200 GS864036T-167 GS864018T-300I GS864018T-250I GS864018T-200I GS864018T-167I GS864032T-300I GS864032T-250I GS864032T-200I GS864032T-167I GS864036T-300I GS864036T-250I GS864036T-200I GS864036T-167I GS864018GT-250 GS864018GT-200 GS864018GT-167 GS864032GT-300
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP
Speed2 (MHz/ns)
300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 250/6.5 200/7.5 167/8 300/5.5
TA3
C C C C C C C C C C C C I I I I I I I I I I I I C C C C
Status
2M x 32 GS864032GT-250 Pipeline/Flow Through Pb-Free TQFP 250/6.5 C Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS864018T-300IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 9/2004
22/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
2M x 32 2M x 32 2M x 36 2M x 36 2M x 36 4M x 18 4M x 18 4M x 18 4M x 18 2M x 32 2M x 32 2M x 32 2M x 32 2M x 36 2M x 36 2M x 36
Part Number1
GS864032GT-200 GS864032GT-167 GS864036GT-250 GS864036GT-200 GS864036GT-167 GS864018GT-300I GS864018GT-250I GS864018GT-200I GS864018GT-167I GS864032GT-300I GS864032GT-250I GS864032GT-200I GS864032GT-167I GS864036GT-300I GS864036GT-250I GS864036GT-200I
Type
Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through Pipeline/Flow Through
Package
Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP Pb-Free TQFP
Speed2 (MHz/ns)
200/7.5 167/8 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5 167/8 300/5.5 250/6.5 200/7.5
TA3
C C C C C I I I I I I I I I I I
Status
2M x 36 GS864036GT-167I Pipeline/Flow Through Pb-Free TQFP 167/8 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS864018T-300IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 9/2004
23/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Product Preview GS864018/32/36T-300/250/200/167
72Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; New
8640xx_r1
Types of Changes Format or Content
Page;Revisions;Reason
* Creation of new datasheet
Rev: 1.00 9/2004
24/24
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

▲Up To Search▲

Price & Availability of GS864018GT-250I

	To Download GS864018GT-250I Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .